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Rapidus Set to Revolutionize the Semiconductor Industry with Support from Japanese Government Grant of ¥590 Billion Yen

Government Aid of $3.9 Billion Approved for Rapidus in Support of 2nm, Multi-Chiplet Technologies

Rapidus Set to Revolutionize the Semiconductor Industry with Support from Japanese Government Grant of ¥590 Billion Yen

In an effort to commercialize 2nm process technology by 2027, Japan-based Rapidus is developing the technology with the support of a significant government grant of ¥590 billion yen ($3.89 billion). This funding will be used for various purposes, including developing the 2nm production node, purchasing cleanroom equipment, and funding the development of multi-chiplet packaging technology. With the added government support, Rapidus is well-positioned to achieve its ambitious goals.

Rapidus aims to commence testing its production by April 2025 and then move on to large-scale production in 2027. The company expects commercial production of 2nm chips to begin in 2025. In addition to collaborating with IBM to develop the fabrication process and constructing its manufacturing facility, Rapidus is focusing on advanced packaging technology for multi-chiplet system-in-packages (SiPs). The latest government subsidies include more than ¥50 billion ($329.85 million) for research and development in this area, marking a first for Japan’s provision of subsidies for such technologies.

One notable aspect of the project is that Rapidus will utilize a section of Seiko Epson Corporation’s Chitose Plant for its back-end packaging processes. This plant is located near Rapidus’ fab in Bibi World, an industrial park in Chitose City where pilot-stage research and development activities will take place. Through collaborations and financial support, Rapidus is confident in its ability to revolutionize the semiconductor industry with its cutting-edge technology.

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